FFF • Dual Extrusion • High-Speed Printing up to 300mm/s • RFID Traceable Workflow
SLS • Low TCO • High Output • High-Precision Prints • Industrial and Functional Material
DLP • True DLP Precision • Faster Prints • RFID Traceable Workflow • Broad Resin Portfolio
DLP • High Resolution Resin Printing • RFID Traceable Workflow • Wide Range of Resin Compatibility
FFF • Dual IDEX • For Fiber-Reinforced Filaments • Dry Boxes • Enclosed Build Chamber
FFF • Dual IDEX • For Flexible Materials up to Shore Hardness 70A • Enclosed Build Chamber
Large-Format FFF (500 × 500 × 500 mm) • Dual IDEX • Carbon Fiber Composites & High-Strength Polymer
Academy
Academy
E2CF Version 0.3.0714 – Jun 17, 2024 Raise3D E2CF Pro3 Series Version 1.3.0411 – Nov 16, 2022 Raise3D Pro3/Pro3 Plus E2 Version 0.3.1026 – Nov 3, 2021 Raise3D E2 Version 0.3.609 – Aug 4, 2021 Raise3D E2 Version 0.2.506 – May 11, 2020 Raise3D E2 Version 0.2.407 – Apr 30, […]
Current Updates Read more about the new features added in ideaMaker 5.2.3 Version 5.2.3 – Apr. 24, 2025 Added FFF & DLP Features Added new DLP slicing templates Added new FFF slicing templates Enhanced the Support Painting function Enabled Tree Support for different layer thicknesses between groups in the group settings Read more about […]
Raise3D Technologies Inc. This Software/Firmware License Agreement (“Agreement”) is a binding agreement between you (“Licensee” or “you”) and Raise 3D Technologies Inc. (“Licensor”). This Agreement governs your use of any software and firmware (including all related documentation, the “Software”) utilized in operating any printer manufactured by Licensor, including the E2CF, the Pro3, the Pro3 […]