FFF • Dual Extrusion • High-Speed Printing up to 300mm/s • RFID Traceable Workflow
SLS • Low TCO • High Output • High-Precision Prints • Industrial and Functional Material
DLP • True DLP Precision • Faster Prints • RFID Traceable Workflow • Broad Resin Portfolio
DLP • High Resolution Resin Printing • RFID Traceable Workflow • Wide Range of Resin Compatibility
FFF • Dual IDEX • For Fiber-Reinforced Filaments • Dry Boxes • Enclosed Build Chamber
FFF • Dual IDEX • For Flexible Materials up to Shore Hardness 70A • Enclosed Build Chamber
Large-Format FFF (500 × 500 × 500 mm) • Dual IDEX • Carbon Fiber Composites & High-Strength Polymer
High modulus tough resin for high temperature resistance
Due to its high surface quality, dimensional accuracy and temperature resistance this tough resin is ideal for interior applications in automotive and mold production.
*All specimen are printed unless otherwise noted. All specimen were conditioned in ambient lab conditions at 19-23°C / 40-60% RH for at least 24 hours. See more details in Technical Data Sheet.
| Testing Method | Green | Post-Processed | |
| Tensile Stress at Break |
ASTM D638 | 39 – 33 MPa | 64 – 70 MPa |
| Young’s Modulus | ASTM D638 | 1680 – 1880 MPa | 2540 – 2600 MPa |
| Elongation at Break |
ASTM D638 | 18 – 24% | 7 – 13% |
| Flexural Modulus | ASTM D790 | 1840 – 1920 MPa | 2585 – 2720 MPa |
| IZOD Impact (Notched) | ASTM D256 | N/A | 22 – 32 J/m |
| Heat Deflection Temp.@0.455 MPa | ASTM D648 | N/A | 81 – 83°C |